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Fraunhofer Institute for Integrated Circuits
3D X-ray Inspection of Ball Grid Array (BGA) Solder Joints
µ-3D Visualiser
The µ-3D Visualiser is the combination of high resolution microfocus X-ray technology and the latest 3D reconstruction methods.
With the aid of the most advanced 3D methods, different object layers are generated by processing images using multiple projections from different angles, e.g. the individual layers of a multilayer board or of optically concealed BGA solder joints can be illustrated separately. This kind of inspection is especially suited for a high precision fault analysis, e.g. with chip on board (COB), flip chip (fc), µBGA joints.
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