Fraunhofer Institute for Integrated Circuits IISImproved 3D chips for ultra HD cameras
Engineering of Adaptive Systems / 8.3.2017
Camera resolution is constantly improving. Meanwhile, users expect hardware components to become smaller and smaller. This is particularly true of ultra HD cameras, which capture four times as many pixels as their full HD counterparts. Researchersat the Engineering of Adaptive Systems (EAS) division in Dresden have developed a compact and energy-saving solution to process the huge volumes of data this entails.
The 3D chip enables a higher resolution for ultra HD cameras.