Fraunhofer Institute for Integrated Circuits IIS
Fraunhofer Institute for Integrated Circuits IIS

Engineering of Adaptive Systems EAS

Modular sensor technology for SMES

Engineering of Adaptive Systems EAS / Cognitive Sensor Technologies / 11.7.2018

© Fraunhofer IIS

The Internet of Things (IoT) presents small and medium-sized enterprises (SMEs) with almost insurmountable hurdles – and widens the digital divide between them and large corporations. This is set to change in the future thanks to a sensor platform that will allow smaller companies to occupy market niches in the IoT sector and to hold their own against international competitors.

Improved 3D chips for ultra HD cameras

Engineering of Adaptive Systems / 8.3.2017

Camera resolution is constantly improving. Meanwhile, users expect hardware components to become smaller and smaller. This is particularly true of ultra HD cameras, which capture four times as many pixels as their full HD counterparts. Researchersat the Engineering of Adaptive Systems (EAS) division in Dresden have developed a compact and energy-saving solution to process the huge volumes of data this entails.

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The 3D chip enables a higher resolution from ultra HD cameras.
© Fraunhofer IIS

The 3D chip enables a higher resolution for ultra HD cameras.

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