Access to semiconductor technologies
- Processes from 350 nm to 12 nm
- Technologies: CMOS, FDSOI, RFSOI, FinFET, GaN/ GaAs, SiC, SiGe, Photonics
- Features: HV, logic, ULP, NVM, OPTO, HF/ RF
Design infrastructure and deployment models
- User-friendly design environments (on-premise or cloud-based) for flexible and scalable IC design
- Access to EDA tools and IP libraries
Design & development services
- Feasibility studies, specification and system design
- Design and development of customized ICs:
- ASICs, IP cores, SoCs & chiplets
- Analog, Digital and Mixed-Signal & RF
- Design optimization:
- Design for Manufacturing
- Design for Testability
Prototyping & Integration
- MPW & Ramp-Up Support
- Access to pilot lines
- Modular integration of chiplets and specialized components
- Connection to semiconductor ecosystem
Transfer to series production
- Migration to full-mask set
- Test & qualification services
- Yield optimization and analyses
- Supply chain management
Access to OSAT and post-fab services
- Customized Packaging Services
- Advanced System Integration
- Product Engineering
- Upscaling.
Further information on Virtual ASIC Foundry can be found here.