News and Pressroom

Latest News

Fraunhofer IIS / 6.7.2026

»Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

Series: Medicine of the future / 29.6.2026

Personalized Medicine: From the Average to the Individual

Fraunhofer IIS / 17.6.2026

Soofi announces model for industrial AI in Europe

Fraunhofer IIS / 1.6.2026

How Mesh Networks Help Control Drone Swarms

Series: Medicine of the future / 21.5.2026

Medical sensor technology for disaster response

Series: Biogenic Value Creation / 6.5.2026

How sugar beets can withstand climate change

Fraunhofer IIS / 6.5.2026

Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)

Series: Artificial Intelligence / 21.4.2026

LLMs in Transition: What Research, Real World Practice, and Europe Are Driving Forward Today

Obituary / 20.4.2026

mp3 pioneer Professor Seitzer has passed away

Series: Medicine of the Future / 1.4.2026

Research for the medicine of tomorrow

Fraunhofer IIS / 26.3.2026

Fraunhofer IIS awarded ESA contract to design a Galileo PRS test space receiver for Low Earth Orbits

Fraunhofer IIS / 3.3.2026

AI Chip Design From Heilbronn

Fraunhofer IIS / 2.3.2026

GiantEye – New Dimensions in Computed Tomography

Fraunhofer IIS / 23.2.2026

ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development

Series: AI / 21.1.2026

Spiking Performance in AI Applications

Fraunhofer IIS / 5.1.2026

A Cost-Effective Solution for Monitoring Aging Infrastructure

News brief / 22.12.2025

Fraunhofer IIS contributed to Emmy® winning MPEG CMAF standard

News brief / 18.11.2025

Eric Fribourg-Blanc visits Fraunhofer IIS – Focus on APECS Pilot Line

Series: Panorama / 4.11.2025

New Impetus for Fraunhofer IIS: Interview on the Expansion of the Institute’s Management

Fraunhofer IIS / 3.11.2025

Smart Sensor Network and AI Algorithms Ease Strain on Stressed Drivers

Fraunhofer IIS / 27.10.2025

Giovanni Del Galdo to Join the Institute Management Team at Fraunhofer IIS

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  • Transparent, customizable, post-quantum secure, and CRA-compliant: The Fraunhofer RISC-V Secure Element / 2026

    »Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

    July 06, 2026

    Gebondeter Chip: das RISC-V Secure Element
    © Fraunhofer IIS / Jürgen Ernst

    With the RISC-V Secure Element, the Fraunhofer Institutes for Integrated Circuits IIS, for Applied and Integrated Security AISEC, and for Electronic Microsystems and Solid State Technologies EMFT are introducing a security chip that was designed and manufactured in Germany. The design is based on transparent open-source hardware, integrates post-quantum cryptography, and can be used as a standalone chip or as a system-on-chip component. The goal is to offer companies a trustworthy and customizable trust anchor – with points of contact in the EU – for connected devices and to support them in meeting the requirements of the European Cyber Resilience Act (CRA).

    more info
  • Berlin – The Soofi consortium presents initial performance results for "Soofi S", the first building block of a European AI model family. The project, funded by the Federal Ministry for Economic Affairs and Energy as part of the IPCEI-CIS / 8ra initiative, aims to develop high-performance foundation models on European infrastructure, offering businesses, public administration, research institutions and start-ups a transparent alternative to non-European models.

    more info
  • Fraunhofer IIS at ILA 2026: networking drones / 2026

    Innovation From Above: How Mesh Networks Help Control Drone Swarms

    June 01, 2026

    In einem Mesh-Netzwerk kommunizieren mehrere Drohnen dezentral miteinander. Ein Mobilfunkmast ist daher nicht nötig.
    © Fraunhofer IIS / Manuel Schraudt

    Drone swarms can monitor progress on large construction sites, inspect remote offshore wind farms and search for survivors after natural disasters. When multiple drones are deployed, they generally are controlled centrally by mobile communications up to now. Researchers at the Fraunhofer Institute for Integrated Circuits IIS are working on a decentralized solution that is less susceptible to interference while at the same time ensuring greater flexibility.

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  • Transmit and receive antenna of the satellite ground station on the roof of Fraunhofer IIS
    © Fraunhofer IIS

    In April 2026, the Fraunhofer Institute for Integrated Circuits IIS successfully demonstrated a broadband 5G NTN connection in the Ka-band frequency range via the geostationary (GEO) satellite Heinrich Hertz. A seamless handover between the two satellite beams of the German communications satellite was also achieved. The transmission and reception equipment, specially adapted for broadband transmission, was installed at the Fraunhofer IIS headquarters in Erlangen. The tests were conducted as part of the Heinrich Hertz mission, led by the German Space Agency at the German Aerospace Center (DLR).

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  • FoX Galileo PR
    © Beyond Gravity

    Nuremberg/Wien/Munich/Noordwijk(NL): The European Galileo satellite navigation system has become a crucial cor-nerstone for global positioning services. As increasingly demanding use cases emerge the need for reliable and highly accurate positioning, navigation, and timing (PNT) services in space continues to grow. The European Space Agency (ESA), on behalf of the European Commission and under the Horizon Europe programme, has awarded a contract to the satellite navigation experts of Fraunhofer IIS – together with Beyond Gravity Austria GmbH, Airbus Defence and Space GmbH, and IABG mbH – to design and develop a first space-ready test prototype for the Galileo Public Regulated Service (PRS). This secure test space receiver STACIE could support institutional and governmental space missions and applications of the European Union member states.

    more info
  • Fraunhofer HNFIZ adds integrated circuits for and with AI to its service range / 2026

    AI Chip Design From Heilbronn

    March 03, 2026

    © Fraunhofer IAF

    Heilbronn: AI plays a huge role in the semiconductor industry, both by facilitating more efficient development processes and as a target application in development work. This is why the Fraunhofer Heilbronn Research and Innovation Centers HNFIZ are adding the Chip AI research and innovation center for AI chip design to their service range. The center is funded via the Dieter Schwarz Foundation. The Chip AI research and innovation center relies on close cooperation with stakeholders of the Innovation Park Artificial Intelligence (IPAI).

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  • Nondestructive testing of very large objects / 2026

    GiantEye – New Dimensions in Computed Tomography

    March 02, 2026

    © Fraunhofer IIS

    Looking inside an object without having to change it by opening it or taking it apart: This is the goal of nondestructive testing (NDT). However, only items that fit in the testing device can be scanned. In the GiantEye project, the Fraunhofer Institute for Integrated Circuits IIS is developing an innovative new high-energy computed tomography system at its Development Center X-Ray Technology in Fürth. This system enables nondestructive testing and digitalization of large and complex objects at the highest level of detail.

    more info
  • Expanding Global Semiconductor Ecosystem through Strategic Partnership in Europe / 2026

    ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development

    February 23, 2026

    ADTechnology, a leading South Korea design house and IP company, and Fraunhofer Institute for Integrated Circuits IIS, a renowned German applied research institution, have officially announced a strategic technology collaboration. The partnership includes the joint development of SoC (System-on-Chip) and Chiplet solutions utilizing Samsung Foundry’s cutting-edge 4 nm technology process.

    more info
  • A new use for vehicle sensor systems / 2026

    A Cost-Effective Solution for Monitoring Aging Infrastructure

    January 05, 2026

    Fraunhofer IIS radar sensor on a railroad bridge
    © Fraunhofer IIS

    Fraunhofer researchers have developed a system that uses sensors and AI to monitor a driver's cognitive load. In the future, this technology could ease driver strain when they reach their stress limit. The system can also be applied in other fields, such as for pilots or surgeons. The researchers are using an innovative sensor network for the project – as well as a PC game for preparing virtual sushi.

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About Fraunhofer IIS

The Fraunhofer Institute for Integrated Circuits IIS performs contract research and development for industry and public authorities in the fields of microelectronic systems and software.

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