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Fraunhofer IIS / 6.7.2026

»Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

Series: Medicine of the future / 29.6.2026

Personalized Medicine: From the Average to the Individual

Fraunhofer IIS / 17.6.2026

Soofi announces model for industrial AI in Europe

Fraunhofer IIS / 1.6.2026

How Mesh Networks Help Control Drone Swarms

Series: Medicine of the future / 21.5.2026

Medical sensor technology for disaster response

Series: Biogenic Value Creation / 6.5.2026

How sugar beets can withstand climate change

Fraunhofer IIS / 6.5.2026

Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)

Series: Artificial Intelligence / 21.4.2026

LLMs in Transition: What Research, Real World Practice, and Europe Are Driving Forward Today

Obituary / 20.4.2026

mp3 pioneer Professor Seitzer has passed away

Series: Medicine of the Future / 1.4.2026

Research for the medicine of tomorrow

Fraunhofer IIS / 26.3.2026

Fraunhofer IIS awarded ESA contract to design a Galileo PRS test space receiver for Low Earth Orbits

Fraunhofer IIS / 3.3.2026

AI Chip Design From Heilbronn

Fraunhofer IIS / 2.3.2026

GiantEye – New Dimensions in Computed Tomography

Fraunhofer IIS / 23.2.2026

ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development

Series: AI / 21.1.2026

Spiking Performance in AI Applications

Fraunhofer IIS / 5.1.2026

A Cost-Effective Solution for Monitoring Aging Infrastructure

News brief / 22.12.2025

Fraunhofer IIS contributed to Emmy® winning MPEG CMAF standard

News brief / 18.11.2025

Eric Fribourg-Blanc visits Fraunhofer IIS – Focus on APECS Pilot Line

Series: Panorama / 4.11.2025

New Impetus for Fraunhofer IIS: Interview on the Expansion of the Institute’s Management

Fraunhofer IIS / 3.11.2025

Smart Sensor Network and AI Algorithms Ease Strain on Stressed Drivers

Fraunhofer IIS / 27.10.2025

Giovanni Del Galdo to Join the Institute Management Team at Fraunhofer IIS

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  • Transparent, customizable, post-quantum secure, and CRA-compliant: The Fraunhofer RISC-V Secure Element / 2026

    »Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

    July 06, 2026

    Gebondeter Chip: das RISC-V Secure Element
    © Fraunhofer IIS / Jürgen Ernst

    With the RISC-V Secure Element, the Fraunhofer Institutes for Integrated Circuits IIS, for Applied and Integrated Security AISEC, and for Electronic Microsystems and Solid State Technologies EMFT are introducing a security chip that was designed and manufactured in Germany. The design is based on transparent open-source hardware, integrates post-quantum cryptography, and can be used as a standalone chip or as a system-on-chip component. The goal is to offer companies a trustworthy and customizable trust anchor – with points of contact in the EU – for connected devices and to support them in meeting the requirements of the European Cyber Resilience Act (CRA).

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  • Berlin – The Soofi consortium presents initial performance results for "Soofi S", the first building block of a European AI model family. The project, funded by the Federal Ministry for Economic Affairs and Energy as part of the IPCEI-CIS / 8ra initiative, aims to develop high-performance foundation models on European infrastructure, offering businesses, public administration, research institutions and start-ups a transparent alternative to non-European models.

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  • Fraunhofer IIS at ILA 2026: networking drones / 2026

    Innovation From Above: How Mesh Networks Help Control Drone Swarms

    June 01, 2026

    In einem Mesh-Netzwerk kommunizieren mehrere Drohnen dezentral miteinander. Ein Mobilfunkmast ist daher nicht nötig.
    © Fraunhofer IIS / Manuel Schraudt

    Drone swarms can monitor progress on large construction sites, inspect remote offshore wind farms and search for survivors after natural disasters. When multiple drones are deployed, they generally are controlled centrally by mobile communications up to now. Researchers at the Fraunhofer Institute for Integrated Circuits IIS are working on a decentralized solution that is less susceptible to interference while at the same time ensuring greater flexibility.

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  • Transmit and receive antenna of the satellite ground station on the roof of Fraunhofer IIS
    © Fraunhofer IIS

    In April 2026, the Fraunhofer Institute for Integrated Circuits IIS successfully demonstrated a broadband 5G NTN connection in the Ka-band frequency range via the geostationary (GEO) satellite Heinrich Hertz. A seamless handover between the two satellite beams of the German communications satellite was also achieved. The transmission and reception equipment, specially adapted for broadband transmission, was installed at the Fraunhofer IIS headquarters in Erlangen. The tests were conducted as part of the Heinrich Hertz mission, led by the German Space Agency at the German Aerospace Center (DLR).

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  • FoX Galileo PR
    © Beyond Gravity

    Nuremberg/Wien/Munich/Noordwijk(NL): The European Galileo satellite navigation system has become a crucial cor-nerstone for global positioning services. As increasingly demanding use cases emerge the need for reliable and highly accurate positioning, navigation, and timing (PNT) services in space continues to grow. The European Space Agency (ESA), on behalf of the European Commission and under the Horizon Europe programme, has awarded a contract to the satellite navigation experts of Fraunhofer IIS – together with Beyond Gravity Austria GmbH, Airbus Defence and Space GmbH, and IABG mbH – to design and develop a first space-ready test prototype for the Galileo Public Regulated Service (PRS). This secure test space receiver STACIE could support institutional and governmental space missions and applications of the European Union member states.

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  • Fraunhofer HNFIZ adds integrated circuits for and with AI to its service range / 2026

    AI Chip Design From Heilbronn

    March 03, 2026

    © Fraunhofer IAF

    Heilbronn: AI plays a huge role in the semiconductor industry, both by facilitating more efficient development processes and as a target application in development work. This is why the Fraunhofer Heilbronn Research and Innovation Centers HNFIZ are adding the Chip AI research and innovation center for AI chip design to their service range. The center is funded via the Dieter Schwarz Foundation. The Chip AI research and innovation center relies on close cooperation with stakeholders of the Innovation Park Artificial Intelligence (IPAI).

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  • Nondestructive testing of very large objects / 2026

    GiantEye – New Dimensions in Computed Tomography

    March 02, 2026

    © Fraunhofer IIS

    Looking inside an object without having to change it by opening it or taking it apart: This is the goal of nondestructive testing (NDT). However, only items that fit in the testing device can be scanned. In the GiantEye project, the Fraunhofer Institute for Integrated Circuits IIS is developing an innovative new high-energy computed tomography system at its Development Center X-Ray Technology in Fürth. This system enables nondestructive testing and digitalization of large and complex objects at the highest level of detail.

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  • Expanding Global Semiconductor Ecosystem through Strategic Partnership in Europe / 2026

    ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development

    February 23, 2026

    ADTechnology, a leading South Korea design house and IP company, and Fraunhofer Institute for Integrated Circuits IIS, a renowned German applied research institution, have officially announced a strategic technology collaboration. The partnership includes the joint development of SoC (System-on-Chip) and Chiplet solutions utilizing Samsung Foundry’s cutting-edge 4 nm technology process.

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  • A new use for vehicle sensor systems / 2026

    A Cost-Effective Solution for Monitoring Aging Infrastructure

    January 05, 2026

    Fraunhofer IIS radar sensor on a railroad bridge
    © Fraunhofer IIS

    Fraunhofer researchers have developed a system that uses sensors and AI to monitor a driver's cognitive load. In the future, this technology could ease driver strain when they reach their stress limit. The system can also be applied in other fields, such as for pilots or surgeons. The researchers are using an innovative sensor network for the project – as well as a PC game for preparing virtual sushi.

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  • Many people are familiar with audio and video codecs, but who knows how many other technologies are required to enable audio or video streaming? One such technology, largely unknown but nonetheless indispensable, is the Common Media Application Format (CMAF), developed by the leading standardization organization in the media world: MPEG (Moving Picture Experts Group). The MPEG Systems Group was honored with the Technology & Engineering Emmy® Award for the CMAF standardization in early December. Colleagues from Fraunhofer IIS made a significant contribution to the development within the MPEG Systems Working Group. The award winners accepted the prestigious golden trophy in New York on December 4.

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  •  visit of Eric Fribourg-Blanc
    © Fraunhofer IIS

    On 17 November, Eric Fribourg-Blanc, Senior Programme Officer at the Chips Joint Undertaking (Chips JU), visited Fraunhofer IIS in Erlangen. He was accompanied by Dirk Schumann, director of the APECS Pilot Line at the Research Fab Microelectronics Germany (FMD). The visit focused on the APECS Pilot Line, a central pillar of the EU Chips Act, which advances the development and transfer of novel chiplet technologies into industrial application.

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  • Sensors on the body send biosignals to a mobile phone via Bluetooth
    © Fraunhofer IIS

    Fraunhofer researchers have developed a system that uses sensors and AI to monitor a driver's cognitive load. In the future, this technology could ease driver strain when they reach their stress limit. The system can also be applied in other fields, such as for pilots or surgeons. The researchers are using an innovative sensor network for the project – as well as a PC game for preparing virtual sushi.

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  • © Fraunhofer IIS / Paul Pulkert

    Erlangen — In conjunction with his appointment as professor of Information Technology and Electronics at Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Giovanni Del Galdo will join the institute management team of the Fraunhofer Institute for Integrated Circuits IIS on November 1, 2025. Previously, he served as a professor at Technische Universität Ilmenau and headed the Electronic Measurements and Signal Processing department at Fraunhofer IIS.

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  • Erlangen, Germany – As the consortium leader of the EU-funded project SpikeHERO, Fraunhofer IIS is setting its sights on fiber optic networks over the next four years. Together with industry and research partners from the Netherlands, Czech Republic, and Belgium, the institute is developing AI chips based on spiking neural networks to significantly improve signal quality and boost data transmission rates in fiber optics. The project launches on October 1, 2025 and is intended to help expand Europe's digital infrastructure and consolidate its technological sovereignty.

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  • Recognizing Singing in Dialogue Enhancement: / 2025

    ARTE Debuts New MPEG-H Dialog+ Feature

    September 16, 2025

    Erlangen (Germany): For quite some time now, Fraunhofer IIS has been delivering MPEG-H Dialog +, a dialogue enhancement solution for broadcast and streaming. The codec separates speech from the rest of a film’s soundtrack and enables its separate enhancement. The audience can then choose between content with the original audio mix and content with easy-to-understand dialogues, providing an ideal solution for people with hearing disabilities, for instance. The latest feature of MPEG-H Dialog+ is available on the video on demand platform of the German-French broadcaster ARTE and will be operational in a few days.

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  • Erlangen/Munich (Germany): The Fraunhofer Institute for Integrated Circuits IIS and ARRI today announced a partnership to combine their expertise in the field of high-quality image coding, color science and cinematic image processing. The goal is to enable transport and storage of highest-quality image data in media and post-production workflows while maintaining full processing flexibility. This collaboration aims to significantly enhance the quality and performance as well as the time-cost-efficiency in current and future media production.

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  • © Fraunhofer IIS

    Erlangen, Germany / North Hollywood (CA), USA: The Fraunhofer-Institute for Integrated Circuits IIS is excited to announce that its moving picture technol-ogy experts receive the world-famous Emmy® Award for engineering, science and technology for its JPEG XS video codec. This forward-looking standard for professional video production pushes the boundaries of high-quality transmis-sion over IP for a wide variety of applications in media and studio technology and streamlines real-time video processing in data centers.

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  • Offshore Windpark im Meer
    © Fraunhofer IWES

    Maintaining wind turbines and identifying potential vulnerabilities is expensive and time-consuming, especially when they are located offshore. As a result, rotor blades are often simply replaced, a costly process, when damage is merely suspected. The Fraunhofer Institute for Integrated Circuits IIS, working in concert with the Fraunhofer Institute for Wind Energy Systems IWES, has developed a solution that can be used to identify cracks and breakage inside the blades remotely at an early stage.

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  • Erlangen (Germany): At the Fraunhofer Institute for Integrated Circuits IIS, researchers at the departments Smart Sensing and Electronics and Supply Chain Services have successfully developed a novel hardware accelerator to reduce the effort of the computationally expensive pricing step in the Simplex Algorithm. This innovative technological breakthrough was presented at the International Symposium on Highly Efficient Accelerators and Reconfigurable Technologies (HEART 2025) conference in Japan in May 2025.

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About Fraunhofer IIS

The Fraunhofer Institute for Integrated Circuits IIS performs contract research and development for industry and public authorities in the fields of microelectronic systems and software.

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In conjunction with a network of international partners, Fraunhofer IIS conducts top-level research for the immediate benefit of industry and the greater good of society.

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