Application Specific Multi-Chip-Modules

ASIC-like integration without the complexity and cost of a full ASIC. 

Many electronics manufacturers today are caught between extremes::

• ASICs are powerful and compact - but development is expensive, lengthy, risky and inflexible.
  
• PCBs are cheap, quickly developed and flexible - but too large, easy to replicate and offer no differentiation.
   

Application-specific MCMs with HDI interposers close precisely this gap:

• More compact than PCB designs
• More cost-efficient & faster in development than ASICs
• Rebuild protection due to closed design and own IC chiplet
• Technology mix possible (µC, FPGA, RF, analog, logic, sensors, memory)
• Versatile due to modular design
• In combination with customer-specific ASICs to strengthen your unique position and guarantee copy protection

• Combination of system and chip design expertise
• Requirements-driven system design process
• Strong network in the IC ecosystem supply chain, especially for small volumes