The APECS pilot line: European chiplet-based innovation
APECS is a central European pilot line for advanced packaging and heterogeneous integration based on chiplet technologies. Under the EU Chips Act, APECS is creating a Europe-wide accessible infrastructure to accelerate the transfer of innovations in microelectronics from research into industrial applications.
As part of the Research Fab Microelectronics Germany (FMD), Fraunhofer IIS contributes through several research divisions to the establishment and operation of the pilot line, thereby making a significant contribution to strengthening Europe’s technological sovereignty.