APECS pilot line

European pilot line for chiplet-based technologies and heterogeneous integration under the EU Chips Act

The APECS pilot line: European chiplet-based innovation

APECS is a central European pilot line for advanced packaging and heterogeneous integration based on chiplet technologies. Under the EU Chips Act, APECS is creating a Europe-wide accessible infrastructure to accelerate the transfer of innovations in microelectronics from research into industrial applications.

As part of the Research Fab Microelectronics Germany (FMD), Fraunhofer IIS contributes through several research divisions to the establishment and operation of the pilot line, thereby making a significant contribution to strengthening Europe’s technological sovereignty.

What is APECS?

APECS stands for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems. It is a decentralized European pilot line that integrates design, manufacturing, and testing into a seamless workflow.

The pilot line aims to provide companies and research institutions with access to state-of-the-art chiplet technologies and integration methods – from design and manufacturing to integration, testing, and demonstrators.

Key focus areas include:

  • STCO (System Technology Co-Optimization) design
  • Chiplet-based system architectures
  • Advanced 2.5D/3D integration approaches
  • New packaging, testing, and reliability concepts
  • End-to-end design-to-production capabilities

APECS is aimed at large industrial enterprises as well as SMEs and startups and provides an important foundation for resilient European semiconductor value chains.

Fraunhofer IIS in APECS: comprehensive chiplet expertise from concept to application

Ein Forscher arbeitet in einem Reinraum in Schutzkleidung an einem Wafer.
© loewn | Bernhard Wolf
Im Rahmen der APECS- Pilotlinie wird in den kommenden Jahren die FuE-Infrastruktur für Halbleitertechnologien und -anwendungen weiter ausgebaut.

As part of APECS, Fraunhofer IIS contributes extensive expertise across the entire microelectronics value chain. Our activities span chip and system design, system-level integration, and the characterization, testing, and failure analysis of modern chiplet-based systems.

A key focus is placed on the development, implementation, and validation of demonstrators that showcase the performance of new chiplet technologies under real-world conditions – for example, for high-performance computing or sensor systems.

The work is carried out across the institute by three participating research divisions of Fraunhofer IIS, each contributing their complementary expertise.

Our participating research divisions

Smart Sensing and Electronics

The Smart Sensing and Electronics research division contributes expertise in the development, integration, and characterization of complex electronic systems to APECS. The focus is on combining sensing, electronics, and system integration, as well as on assessing the reliability and performance of modern chiplet-based solutions.

Contribution to APECS:

  • System and chiplet design
  • Integration and electrical characterization
  • Development of application-oriented demonstrators
  • Assessment of performance and reliability

Engineering of Adaptive Systems division

As part of APECS, the Engineering of Adaptive Systems division focuses on developing methods and technologies for chiplet-based architectures, particularly for adaptive and high-performance electronic systems. A key focus is on a holistic approach to design, integration, and testing.

Contribution to APECS:

  • Chiplet architectures and integration
  • Design methodologies across the value chain
  • System Technology Co-Optimization (STCO)
  • Development and validation of demonstrators

Development Center X-ray Technology

The Development Center X-ray Technology complements APECS with proven expertise in high-resolution X-ray-based analysis and characterization of electronic assemblies. These methods are essential for quality assurance, failure analysis, and the reliability assessment of modern packaging and integration technologies.

Contribution to APECS:

  • X-ray-based inspection and analysis
  • Failure analysis at the chip and system level
  • Support for testing and reliability concepts
  • Quality assurance in chiplet integration

Technological
focus areas

Fraunhofer IIS activities within APECS focus on:

  • Chiplet design and heterogeneous integration
  • Advanced packaging technologies (2.5D / 3D)
  • Testing, characterization, and reliability
  • System demonstrators for advanced applications

The close integration of design, integration, analysis, and validation enables the development of robust, industry-ready solutions for future microelectronic systems.

APECS in the European network

APECS is part of a Europe-wide network of leading research and technology organizations and is undertaken under the EU Chips Act as well as national funding programs. As part of the Research Fab Microelectronics Germany (FMD), Fraunhofer IIS collaborates closely with other institutes and partners.

This strong collaboration within the network ensures the rapid transfer of research results into industrial applications and strengthens the long-term competitiveness of European microelectronics.

The APECS consortium brings together the technological expertise, infrastructure, and know-how from ten partners across eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator with FBH and IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC), and Portugal (INL).

APECS Partners
APECS-Konsortium

Funding:

APECS is co-funded by the Chips Joint Undertaking and national funding authorities from Belgium, Germany, Finland, France, Greece, Austria, Portugal, and Spain under the “Chips for Europe” initiative.

Substantial funding from the German Federal Ministry of Research, Technology and Space (BMFTR) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt enables the continued expansion of R&D infrastructure within the APECS pilot line in the coming years.

This project is supported by the European Union’s European Regional Development Fund (ERDF).

APECS Funding Partners
APECS Funding Partners

Contact and collaboration

Are you interested in collaborating in the APECS pilot line or would you like to learn more about our contributions?

Get in touch with us – we are happy to support you with your specific questions related to chiplets, advanced packaging, and heterogeneous integration.

Jana Just

Contact Press / Media

Dr. rer. nat. Jana Just

Senior Project Manager

Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen, Germany

Benjamin Prautsch

Contact Press / Media

Dr. Benjamin Prautsch

Head of Business Unit »Chiplet and Chip Design«

Fraunhofer IIS, Division Engineering of Adaptive Systems
Münchner Straße 16
01187 Dresden, Germany

Phone +49 351 45691-280

Astrid Hölzing

Contact Press / Media

Dr. rer. nat. Astrid Hölzing

Head of group NanoCT systems

Flugplatzstr. 75
90768 Fürth

Phone +49 93 131-84457