Fraunhofer Institute for Integrated Circuits IIS

electronica 2026

Munich Trade Fair Center / November 10, 2026 - November 13, 2026

electronica 2026

Hall C5 Booth 241

Presentations at the Embedded Developer Forum at electronica 2026

Conference Session	Title	Speaker
Booth C6 \| C6.501 November 12, 2026 \| 1:20–1:40 p.m.	Towards a Zero Power Radio Receiver – UHF Triband Receiver IC FH101RF for Maintenance-Free Wireless Applications	Prof. Dr.-Ing. Heinrich Milosiu

Chip Design - IoT - edgeAI: Innovation for our Industry

At electronica we will present new solutions and systems for edgeAI, for energy efficiency and for robust and reliable electronic systems.

edge IoT

Powering IoT Sensors for the Long Run

Energy Harvesting Systems feature unlimited power and low maintenance costs when integrated in IoT systems or edge sensor devices. We provide thermal as well as mechanical harvesters, voltage converters together with micro-energy management and system integration in you sensor system.

We provide customized adaption to your requirements.

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edge AI

Neuromorphic Computing for Edge AI

Current neural network architectures require high computing power and a lot of energy. Neuromorphic hardware uses massive parallel processing to perform machine learning faster and more energy-efficiently, among other things. Efficient architectures that optimize computing power, energy consumption and chip area are crucial for the use of neural networks in embedded devices.

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edge IoT

RFicient® – Ultra-low-power-Wake-Up-Receiver

With less than 3 µA, RFicient® enables fast, millisecond-range, reliable, and highly energy-efficient wireless communication across three license-free bands – easily integrated and ideal for battery-powered, energy-autonomous, ultra-low-power IoT applications.

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Chip Design

MicroBias: Hall sensor & micromagnet on a single chip

Fully integrated, miniaturized back-biased Hall sensors enable highly precise, multidimensional magnetic field measurements in a compact design. MicroBias integrates micro-magnets at wafer level, creating robust and cost-effective sensor systems with precise field shaping and accurate positioning – significantly smaller, more affordable and requiring almost no rare-earth materials.

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Chip Design

nanoSPECTRAL: Multispectral & polarization sensors

Our nanoSPECTRAL technology cost-effectively integrates optical nanostructures directly into CMOS processes. The chip-size-spectrometer offers 320 channels from VIS to NIR, enabling applications in agricultural technology, analytics, food and medical technology – for example, the digital readout of test strips, which we will demonstrate live at the trade fair.

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Chip Design

Custom IC Development & Full IC Value Chain Enablement

Fraunhofer IIS supports the entire IC design process for innovations and commercial products – from ideas series transfer. This includes fabrication and technology access, design infrastructure, custom IC development, prototyping, packaging, testing, qualification, and supply chain support.

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Chip Design

Customized Sensor Signal Processing ICs

Intelligent signal processing enables precise, energy-efficient sensor systems. For force, pressure, and bridge sensors as well as similar sensing elements, we develop scalable, customer-specific solutions with the goal of a flexible ASIC platform for various use cases. At the trade fair, we will also present a low-power sensor signal processing IC combined with neuromorphic hardware.

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Chip Design

Bavarian Chip-Design-Center

The Bavarian Chip-Design-Center strengthens chip design capabilities in Bavaria and makes it easier for companies to access chip design and supply chains. It develops IP portfolios, promotes talent with targeted trainee programs and further training and provides access to its own ICs as prototypes and small series. At electronica BCDC presents a CRA-compliant Secure SoC platform.

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Contact

Contact Press / Media

Angela Raguse

Marketing and Communication

Fraunhofer IIS
Nordostpark 84
90411 Nürnberg, Germany

Phone +49 9131 776-5105

Send email

Contact Press / Media

Jessica Lipus

Marketing and Communications, Research Area Smart Sensing and Electronics

Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen, Germany

Send email