MicroBias: Compact Magnetic Sensing with Wafer-level Integrated Micromagnets

Hall sensor and micromagnet on a single chip

Graphic of MicroBias
© Fraunhofer IIS
MicroBias integrates permanent micromagnets and two Hall sensing elements (blue) on a single chip.

Conventional sensor-magnet assemblies are increasingly constrained by installation space, alignment tolerances and the use of rare-earth materials. MicroBias is a sensor technology that overcomes these constraints by monolithically integrating a permanent micromagnet directly into the sensor chip at wafer-level.

This allows the magnetic field source, sensing elements and signal-processing algorithms to be designed as a single optimized system. Unlike conventional back-biased assemblies, magnet and sensor structures are aligned with sub-micrometre precision, enabling application-specific magnetic field shaping and highly efficient use of magnetic material.

As a result, MicroBias achieves the performance of significantly larger conventional systems while reducing sensor-magnet volume by up to 100 times and rare-earth magnet material by up to 99 %. This combination of miniaturization, precision and material efficiency opens new possibilities for compact, precise and resource-efficient motion and condition sensing.

At a glance: Technical key facts and benefits

key facts Benefits
  • Wafer-level integrated permanent micromagnets
  • Monolithic chip-size magnetic sensing system
  • Sub-micrometre alignment of micromagnet and sensing elements
  • Application-specific local magnetic-field shaping
  • Co-design of magnet, sensor, mechanics and signal-processing algorithms
  • Compatible with a wide range of semiconductor manufacturing platforms
  • Realization of miniaturized multi-dimensional sensing applications
  • Applicable to all sensor principles on silicon substrates (including Hall, AMR, GMR, TMR etc.)

 

  • Maintains measurement performance with smaller magnets
  • Up to 100 × smaller sensor-magnet volume* 
  • Up to 99 % less rare-earth magnet material*
  • No separate package-level bias-magnet placement
  • Defined and reproducible field geometry for tailored sensing concepts
  • Significantly reduced supply chain dependence through the use of fewer rare earth materials
  • Greater supply-chain flexibility 


*Compared with comparable conventional sensor-magnet assemblies.

Our offer: From precision field design to integrated magnetic sensing solutions

MicroBias builds on the combined expertise of Fraunhofer IIS, Fraunhofer ISIT and Fraunhofer IFAM in magnetic sensing, wafer-level micromagnet integration, magnetic materials, ASIC design and signal processing. This unique combination of interdisciplinary know-how enables us to develop application-specific sensing solutions in which magnet, sensor and algorithms are optimized as a single system.

  • Application analysis, feasibility studies and magnetic-system co-design
  • Magnetic-system modelling and simulation for application-specific sensing concepts
  • Multi-dimensional Hall-sensor, ASIC and algorithm development for custom measurement tasks
  • PowderMEMS-based wafer-level micromagnet integration, including material, process and quality engineering
  • Prototype development, characterization and pilot-scale validation of integrated sensor-magnet systems
  • Technology transfer, licensing and joint development projects, including future GMR and TMR adaptations

Applications: Compact motion and condition sensing for space-constrained systems

MicroBias is particularly suited to motion and condition sensing applications where installation space is limited and sensor and mechanics can be optimized together. The wafer-level integration of the micromagnet enables highly compact sensing solutions while maintaining precise and robust measurement data. This combination opens up a wide range of applications in robotics, industrial automation and predictive maintenance: 

  • Robotic joints and compact actuators
  • End effectors and gripper systems
  • Automation and handling modules
  • Space-constrained machine components
  • Motion monitoring of moving machine elements
  • Condition monitoring in hard-to-access locations
  • Wear detection for predictive maintenance

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10.-13.11.2026 | Munich

electronica 2026

Exchange ideas with us at electronica 2026 from November 10 to 13 in Munich. Our experts in the fields of neuromorphic computing, ultra-low-power wake-up receivers, IC design, sensor systems and the Bavarian Chip-Design-Center await you. 

Visit us in Hall C5, Stand 241 – we look forward to seeing you!

Fraunhofer ISIT

PowderMEMS

PowderMEMS is Fraunhofer ISIT's patented microfabrication process for the generation of three-dimensional functional microstructures on wafer level.
The technology opens up numerous degrees of freedom for the realization of novel microcomponents with innovative functionalities.

 

Research Area

Magnetic Sensor Systems

How we gain more information from your magnetic fields.