Erlangen: With MicroBias, the Fraunhofer Institute for Integrated Circuits IIS presents a technology that integrates permanent micromagnets directly into the silicon substrate of a sensor chip at wafer level. While maintaining comparable measurement performance, the technology can reduce the combined sensor-magnet volume to as little as one hundredth of conventional systems and reduce the use of rare-earth materials by up to 99 percent. Developed in cooperation with the Fraunhofer Institute for Silicon Technology ISIT and the Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, the technology provides a monolithic sensor solution for precise, compact motion and condition sensing in robotics, automation and mechanical engineering. MicroBias will be presented at electronica in Munich from November 10 to 13, 2026, in Hall C5, Booth 241.
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